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HOME > 기술개발 > 개발제품 > CMP Retainer Ring
개발제품
당사 개발품 중점 Focusing Point
CMP Process are generally measured on these parameters
 Cost per Wafer
 Defectively (Scratch, Particle, etc.)
- Removal Rate and Uniformity
  (Step height, Dishing/Erosion, Surface roughness, etc.)
- Process Stability
  (Repeatability for In wafer, wafer to wafer, Lot to Lot, etc.)
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