Business

Process

Will be S&T R&D

As a global leader in the Semiconductor & Display processing industries,
Will be S&T is dedicated to continuous efforts in research and development.

R&D Overview

VISION
Securing Global Competitive Advantage
MISSION
  • Market leadership through core technology development

  • Structuring a systematic
    R&D framework

  • Customer-oriented
    product development

STRATEGY
Acquiring key research talent
  • Product development based on thorough analysis of customer needs

  • Collection of new product/new technology information and formulation of response strategies

  • Establishment of an R&D system

INFRA

With our extensive development experience and know-how, we are committed to pioneering new technologies. Our ongoing R&D investments and expansion of research personnel aim to achieve cutting-edge, high-value-added technological developments.

Propriety Technologies

Patent
Government Projects Status
No Program Name Project Title
(Implementing Department/Agency)
1 Technology Doctor Program
(Gyeonggi Techno Park)
Automation of thermal bonding manufacturing process for Teflon sealing components used in display production equipment.
2 Green Manufacturing Site Project
(Small and Medium Business Administration)
Development of an automated system for the Teflon insulation component assembly process in display manufacturing.
3 Gyeonggi Province Technology Development Project (Gyeonggi Province) Development of high-performance plastic internal metal-insert CMP Retainer Ring.
4 Prototype Production Support Project
(Bucheon Industrial Promotion Agency)
Development of injection mold for high-performance metal-insert CMP Retainer Ring.
5 Technology Innovation Development Project
(Small and Medium Business Administration)
Development of high-performance retainer rings with innovative materials for insert molding in semiconductor CMP processes.
Pre-Verification through Analysis

Before prototype production, computer simulations are conducted to predict and improve key performance aspects such as molding and thermal changes and anticipate and address potential issues in advance.


  • CMP Retainer Ring forming analysis


  • CMP Retainer Ring cross-sectional analysis


  • FPD CVD Insulator thermal deformation analysis

Pre-verification through 3D Modeling

Meeting customer requirements by providing a variety of solutions during product development through preliminary 3D modeling verification of significant products

Testing Equipment & Program
  • Radiographic Tester(RT)
  • Ultrasonic Tester(UT)
  • Rockwell Hardness Testing Machine